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印制电路板的IPC标准目录(一)

文章出处:诚暄PCB 人气:作者:小编 发表时间:2020-03-05 17:18:54

  印制电路板(Printed Circuit Boards)

  IPC-6010 Series IPC-6010 Qualification and Performance Series

  IPC-6010印制电路板质量标准和性能规范系列手册

  IPC-A-600F Acceptability of Printed Boards

  印制板验收条件

  IPC-6011 Generic Performance Specification for Printed Boards

  印制板通用性能规范

  IEC/PAS 62214 Generic Performance Specification for Printed Boards

  印制板总体性能规范

  IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

  刚性印制板的鉴定与性能规范 (包括修改单1)

  IEC/PAS 62250 Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

  刚性印制板的鉴定与性能规范

  IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections

  有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范

  IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards

  聚合物厚膜印制板的鉴定与性能

  IPC-QE-605A Printed Board Quality Evaluation Handbook

  印制板质量评价

  IPC-PWB-EVAL-CH Printed Wiring Board Defect Evaluation Chart

  印制play视频在线板瑕疵评价play视频新华人在线图册

  IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards

  封入式分立布线互连板通用规范

  IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards

  印制板分立play视频在线的设计及成品要求(包括修改单1)

  IPC-DW-426 Specification for Assembly of Discrete Wiring 分立play视频在线组装规范

  IPC-HM-860 Specification for Multilayer Hybrid Circuits 多层混合电路规范

  IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards

  多层互连板热特性

  IPC-TR-481 Results of Multilayer Tests Program Round Robin

  多层印制板联合试验计划结果

  IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

  用于电子元件安装与互连的印制板质量评价

  IPC-TR-578 Leading Edge Manufacturing Technology Report

  前沿制造技术报告

  IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

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